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M
Features
* * * * * * * *
TC962
General Description
The TC962 is an advanced version of the industry standard TC7662 high voltage DC-to-DC converter. Using improved design techniques and CMOS construction, the TC962 can source as much as 80mA versus the 7662's 20mA capability. As an inverter, the TC962 can put out voltages as high as 18V and as low as 3V without the need for external diodes. The output impedance of the device is a low 28 (with the proper capacitors), voltage conversion efficiency is 99.9%, and power conversion efficiency is 97%. The low voltage terminal (pin 6) required in some TC7662 applications has been eliminated. Grounding this terminal will double the oscillator frequency from 12kHz to 24kHz. This will allow the use of smaller capacitors for the same output current and ripple, in most applications. Only two external capacitors are required for inverter applications. In the event an external clock is needed to drive the TC962 (such as paralleling), driving this pin directly will cause the internal oscillator to sync to the external clock. Pin 1, which is used as a test pin on the 7662, is a voltage reference zener on the TC962. This zener (6.4V at 5mA) has a dynamic impedance of 12 and is intended for use where the TC962 is supplying current to external regulator circuitry and a reference is needed for the regulator circuit. (See Section 3.0 Applications Information). The TC962 is compatible with the LTC1044, SI7661 and ICL7662. It should be used in designs that require greater power and/or less input to output voltage drop. It offers superior performance over the ICL7660S.
High Current Charge Pump DC-to-DC Converter
Pin Compatible With TC7662/ICL7662/SI7661 High Output Current 80mA No External Diodes Required Wide Operating Range 3V to 18V Low Output Impedance 28 Typ. No Low Voltage Terminal Required Application Zener On-Chip OSC Frequency Doubling Pin Option for Smaller Output Capacitors
Applications
* * * * Laptop Computers Disk Drives Process Instrumentation P-Based Controllers
Device Selection Table
Part Number TC962COE TC962CPA TC962EPA TC962IJA TC962MJA Package 16-Pin SOIC Wide 8-Pin Plastic DIP 8-Pin Plastic DIP 8-Pin CERDIP 8-Pin CERDIP Operating Temp. Range 0C to +70C 0C to +70C -40C to +85C -25C to +85C -55C to +125C
Package Type
16-Pin SOIC Wide 8-Pin DIP 8-Pin CERDIP
Zener 8 VDD Cathode 1 * C+ 2 TC962CPA 7 COSC 6 FREQ x 2 GND 3 TC962IJA -4 C TC962MJA 5 VOUT Zener Cathode 1 NC 2 C+ 3 NC 4 GND 5 NC 6 C- 7 NC 8 16 VDD 15 NC 14 COSC 13 NC
TC962EPA
TC962COE
12 FREQ x 2 11 NC 10 VOUT 9 NC
2002 Microchip Technology Inc.
DS21484B-page 1
TC962
Functional Block Diagram
8 FREQ x 2 - OSC/C Timing 6 7 Level Shift P SW1 2 CAP + I I VDD
TC962
Q + - F/F C Q
Comparator with Hysteresis
Level Shift
N SW4
+ CP External 3 GND
Zener Cathode
1 6.4V VREF + Level Shift OUT N SW2 4 CAP - CR EXT
RL
Level Shift
N SW3 5 VOUT
DS21484B-page 2
2002 Microchip Technology Inc.
TC962
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage (VDD to GND) ..............................+18V Input Voltage Any Pin ......................... (VDD +0.3) to (VSS -0.3) (Note 1) Current Into Any Pin............................................ 10mA ESD Protection ................................................ 2000V Output Short Circuit ........... Continuous (at 5.5V Input) Package Power Dissipation (TA 70C) SOIC ....................................................... 760 mW PDIP........................................................ 730 mW CERDIP .................................................. 800 mW Package Thermal Resistance CERDIP, RJ-A ......................................... 90C/W PDIP, RJ-A ............................................ 140C/W Operating Temperature Range CPA, COE ....................................... 0C to +70C IJA ................................................ -25C to +85C EPA .............................................. -40C to +85C MJA ............................................ -55C to +125C Storage Temperature Range ............. -65C to +150C
TC962 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD = 15V, TA = 25C (See Figure 3-1) unless otherwise noted. Symbol VDD IS Parameter Supply Voltage Supply Current VDD = 15V Min 3 -- -- -- -- -- -- -- -- -- -- -- -- 93 -- 99 -- 96 6.0 -- Typ -- -- 510 560 650 190 210 210 32 35 -- 12 24 97 -- 99.9 -- -- 6.2 12 Max 18 -- 700 -- -- -- -- -- 37 40 50 -- -- -- -- -- -- -- 6.4 -- Units V
A
Test Conditions RL = TA = +25C 0 TA +70C -55C TA +125C TA = +25C 0 TA +70C -55C TA +125C IL = 20mA, VDD = 15V IL = 80mA, VDD = 15V IL = 3mA, VDD = 5V Pin 6 Open Pin 6 GND RL = 2k RL = Over temperature range IZ = 5mA IL = 2.5mA to 7.5mA
VDD = 5V
RO
Output Source Resistance Oscillator Frequency Power Efficiency Voltage Efficiency
FOSC PEFF VDEF
kHz % %
VZ ZZT
Note 1:
Zener Voltage Zener Impedance
V
Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no inputs from sources operating from external supplies be applied prior to "power up" of the TC962.
2002 Microchip Technology Inc.
DS21484B-page 3
TC962
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (8-Pin DIP) (8-Pin CERDIP) 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Symbol Zener Cathode C+ GND CVOUT FREQ x 2 COSC VDD Cathode of internal zener diode. Positive side of external CP capacitor (pump cap). Ground terminal. Negative side of external CP capacitor (pump cap). Output voltage. If grounded, frequency doubles. Capacitor to GND will decrease frequency. Input voltage. Description
Pin No. (16-Pin SOIC) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Symbol Zener Cathode NC C
+
Description Cathode of internal zener diode. No connect. Positive side of external CP capacitor (pump cap). No connect. Ground terminal. No connect. Negative side of external CP capacitor (pump cap). No connect. No connect. Output voltage. No connect. If grounded, frequency doubles. No connect. Capacitor to GND will decrease frequency. No connect. Input voltage.
NC GND NC C
-
NC NC VOUT NC FREQ x 2 NC COSC NC VDD
DS21484B-page 4
2002 Microchip Technology Inc.
TC962
3.0
3.1
APPLICATIONS INFORMATION
Theory of Operation
internal to the TC962. Grounding pin 6 will turn on a current source and double the frequency. This will double the charge current going into the internal capacitor, as well as any capacitor added to pin 7. A zener diode has been added to the TC962 for use as a reference in building external regulators. This zener runs from pin 1 to ground.
The TC962 is a capacitive pump (sometimes called a switched capacitor circuit), where four MOSFET switches control the charge and discharge of a capacitor. The functional block diagram shows how the switching action works. SW1 and SW2 are turned on simultaneously, charging CP to the supply voltage, VIN. This assumes that the on resistance of the MOSFETs in series with the capacitor results in a charging time (3 time constants) that is less than the on time provided by the oscillator frequency as shown: 3 (RDS(ON) CP) < CP/(0.5 fOSC) In the next cycle, SW1 and SW2 are turned off and after a very short interval of all switches being off (this prevents large currents from occurring due to cross conduction), SW3 and SW4 are turned on. The charge in CP is then transferred to CR, but with the polarity inverted. In this way, a negative voltage is now derived. An oscillator supplies pulses to a flip-flop that is then fed to a set of level shifters. These level shifters then drive each set of switches at one-half the oscillator frequency. The oscillator has two pins that control the frequency of oscillation. Pin 7 can have a capacitor added that is returned to ground. This will lower the frequency of the oscillator by adding capacitance to the timing capacitor
3.2
Latch Up
All CMOS structures contain a parasitic SCR. Care must be taken to prevent any input from going above or below the supply rail, or latch up will occur. The result of latch up is an effective short between VDD and VSS. Unless the power supply input has a current limit, this latch up phenomena will result in damage to the device. (See AN763 Latch-up Protection of CMOS ICs.)
FIGURE 3-1:
690
TEST CIRCUIT
IS NC + 10F CP 1 2 3 4 8 7 IL COSC 5 RL
V+ (+5V)
TC962
VOUT (-5V) CR + 10F
FIGURE 3-2:
TYPICAL APPLICATIONS
Split V+ In Half
V+ 1 VD1 VD2 VOUT = -V + C R1 10F CR + 10F + VOUT = 2V + -2V 10F VOUT = V+ 2 CP
D
Combined Negative Converter and Positive Multiplier
V+ 1 2 + 10F 3 CP2 4 CP1 + 8 7
8 7
2 + 10F 3 4
TC962
6 5 +
TC962
6 5
Lowering Output Resistance by Paralleling Devices
V+
Positive Voltage Multiplier
V+
1 2 CP1 + 10F 3 4
8 7 + 10F
1 2 CP2 3 4
8 7
1 2 3 4 VOUT CR + 10F
8 7 VD1 VD2 CP + 10F CP + 10F VOUT = 2V +-2V
TC962
6 5
TC962
6 5
TC962
6 5
D
2002 Microchip Technology Inc.
DS21484B-page 5
TC962
4.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Circuit of Figure 3-1, CP = CR = 10F, CPESR CRESR 1.
Supply Current vs. Temperature
700 600 10k
Oscillator Frequency vs. C OSC
20 TA = +25C 18
Frequency vs. Temperature
COSC = FREQ x 2 = OPEN
SUPPLY CURRENT (A)
400 300 200 100 0 -60 -40 -20
V + = 15V
FREQUENCY (Hz)
1k
FREQUENCY (kHz)
1 10 100 1000 10,000
500
16 14 12 10 8
100
V + = 15V
10 0 20 40 60 80 100 120 140 TEMPERATURE (C) CAPACITANCE (pF)
6 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (C)
Output Resistance vs. Temperature
80 OUTPUT RESISTANCE ( ) 70 60 50 40 30 20 10 -60 -40 -20 V+ = 15V IL = 20mA 10 0 4.5 V+ = 5V IL = 3mA 50
Current vs. Zener Voltage
POWER CONVERSION EFFICIENCY (%) TA = +25C
Power Conversion Efficiency vs. I LOAD
100 90 80 70 60 50 40 30 20 10 0 8 16 24 32 40 48 56 64 72 80 SUPPLY CURRENT EFFICIENCY TA = +25C 150 SUPPLY CURRENT (mA) 135 120 105 90 75 60 45 30 15 0 LOAD CURRENT (mA)
CURRENT (mA)
40
30
20
0 20 40 60 80 100 120 140 TEMPERATURE (C)
4.0
5.5
6.0
6.5
7.0
ZENER VOLTAGE (V)
Output Resistance vs. Input Voltage
110 100 TA = +25C
OUTPUT RESISTANCE ()
90 80 70 60 50 40 30 20 10 0 2 4 6 8 10 12 14 16 18 INPUT VOLTAGE (V) 20 3mA 20mA
DS21484B-page 6
2002 Microchip Technology Inc.
TC962
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
5.2
Package Dimensions
8-Pin CDIP (Narrow)
.110 (2.79) .090 (2.29) PIN 1
.300 (7.62) .230 (5.84)
.055 (1.40) MAX. .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18)
.020 (0.51) MIN. .320 (8.13) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) Dimensions: inches (mm)
.150 (3.81) MIN.
3 MIN.
8-Pin Plastic DIP
PIN 1
.260 (6.60) .240 (6.10)
.045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92)
.070 (1.78) .040 (1.02)
.310 (7.87) .290 (7.37)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87)
3 MIN.
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21484B-page 7
TC962
Package Dimensions (Continued)
16-Pin SOIC (Wide)
PIN 1
.299 (7.59) .419 (10.65) .291 (7.40) .398 (10.10)
.413 (10.49) .398 (10.10) .104 (2.64) .097 (2.46) .050 (1.27) TYP. .019 (0.48) .014 (0.36) .012 (0.30) .004 (0.10)
8 MAX. .050 (1.27) .016 (0.40)
.013 (0.33) .009 (0.23)
Dimensions: inches (mm)
DS21484B-page 8
2002 Microchip Technology Inc.
TC962
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21484B-page9
TC962
NOTES:
DS21484B-page10
2002 Microchip Technology Inc.
TC962
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21484B-page 11
M
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DS21484B-page 12
2002 Microchip Technology Inc.

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